Thermal characterization and stress analysis of Ho2O3 thin film on 4H–SiC substrate
2022Materials Science in Semiconductor ProcessingJournal
10.1016/j.mssp.2022.107110Full text2 citations
2022Materials Science in Semiconductor ProcessingJournal
10.1016/j.mssp.2022.107110Full text2 citations
6 authors across 3 institutions in 3 countries.
Assignment is probabilistic — a work belongs to several fields in proportions.
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2022 · Materials Science in Semiconductor Processing · 2 citations
https://openalex.org/W4296225900