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Sankore

Named after the University of Sankore in Timbuktu — one of the world’s oldest centres of learning. Every figure here is computed from work-level records in our own graph, never copied from a source’s summary count.

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Coverage is partial and says so. A country appears with its research output only once its works have been swept; until then the portal shows whatever the graph happens to hold for it and labels it as exactly that.

Rice husk ash-enhanced Sn–5.0Sb-0.7Cu (SSC507) solder: Intermetallic layer growth and diffusion behavior

2026Journal of Materials Science Materials in ElectronicsJournal

10.1007/s10854-026-17105-2 Full text1 citations

Authors

6 authors across 4 institutions in 2 countries.

T. T. Dele-AfolabiFirst authorCorresponding
M. A. Azmah Hanim
O. J. Ojo-Kupoluyi
Abdul Azeez Olayiwola Sirajudeen
- Crescent University (NG)
Yusuf Olanrewaju Busari
A. O. AdelekeSenior author

Fields

Assignment is probabilistic — a work belongs to several fields in proportions.

Electronic Packaging and Soldering Technologieslevel 3 · 0.98
Metallurgical and Alloy Processeslevel 3 · 0.00
Semiconductor materials and interfaceslevel 3 · 0.00

Sources

Several sources describing one work is the point — it means the record rests on more than one authority.

openalexseen September 9, 2026
2026 · Journal of Materials Science Materials in Electronics · 1 citations
https://openalex.org/W7151009351

Rice husk ash-enhanced Sn–5.0Sb-0.7Cu (SSC507) solder: Intermetallic layer growth and diffusion behavior · Sankore