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Sankore

Named after the University of Sankore in Timbuktu — one of the world’s oldest centres of learning. Every figure here is computed from work-level records in our own graph, never copied from a source’s summary count.

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Coverage is partial and says so. A country appears with its research output only once its works have been swept; until then the portal shows whatever the graph happens to hold for it and labels it as exactly that.

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

2022Journal of Materials Science Materials in ElectronicsJournal

10.1007/s10854-022-07974-8 Full text14 citations

Authors

12 authors across 4 institutions in 3 countries.

T.T. Dele-AfolabiFirst authorCorresponding
- Ajayi Crowther University (NG)
as printed: T. T. Dele-Afolabi
M. A. Azmah Hanim
M. A. Azmah Hanim
M. A. Azmah Hanim
M. A. Azmah Hanim
K. Vidyatharran
Khamirul Amin Matori
as printed: K. A. Matori
O. Saliza Azlina
R. CalinSenior author
R. CalinSenior author
R. CalinSenior author
R. CalinSenior author

Fields

Assignment is probabilistic — a work belongs to several fields in proportions.

Electronic Packaging and Soldering Technologieslevel 3 · 1.00
Aluminum Alloys Composites Propertieslevel 3 · 0.99
3D IC and TSV technologieslevel 3 · 0.99

Sources

Several sources describing one work is the point — it means the record rests on more than one authority.

openalexseen September 9, 2026
2022 · Journal of Materials Science Materials in Electronics · 14 citations
https://openalex.org/W4220680769

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish · Sankore