Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
2023Journal of Materials Research and TechnologyJournalOpen access
10.1016/j.jmrt.2023.06.193Full text114 citations
2023Journal of Materials Research and TechnologyJournalOpen access
10.1016/j.jmrt.2023.06.193Full text114 citations
10 authors across 4 institutions in 2 countries.
Assignment is probabilistic — a work belongs to several fields in proportions.
Several sources describing one work is the point — it means the record rests on more than one authority.
2023 · Journal of Materials Research and Technology · 114 citations
https://openalex.org/W4381950797